MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX C

C.7 CHANGE PROCEDURES

C.7.1 Design, construction and process change control procedures. Any changes to the manufacturer's certified

process flow or design and construction are to be governed by the manufacturer's TRB. All changes should be

documented as to the reason of the change with supporting data taken to justify the change, as appropriate. All

changes shall be classified by the TRB as major or minor. For any change that merits consideration for

requalification, the TRB will decide if requalification is needed. The effect on any test optimization shall be evaluated

prior to the implementation of a design change. Notification of major changes should be made concurrently to the

qualifying activity.

C.7.1.1 Change notification. Any changes that will affect the design and construction information are considered

major changes (see DLA Land and Maritime Form 36D). The qualifying activity shall be provided the latest design

and construction information to keep DLA Land and Maritime files current.

C.7.2 Design and process methodology change. Changes in the design and process methodology to be evaluated

by the TRB will include, but not be limited to, changes in the following areas:

Technology flow chart (see C.5.1.1).

FMEA (see C.5.2).

Control plan (C.5.3).

Bill of materials.

Any changes that affect form, fit, or function.

C.8. QUALIFICATION, VALIDATION, OPTIMIZATION, AND CONTINUOUS IMPROVEMENT

C.8.1 QML processing. The QML manufacturer is expected to use the following items within each technology

family.

Design qualification.

Process optimization.

Process validation.

Continuous improvement.

Qualification.

C.8.1.1 Design qualification. The qualification activity will commence as soon as a "design freeze" is agreed upon

that can meet the targeted performance criteria and the product target specification (mechanical/electrical/

reliability/thermal). Prior to the start of the product design qualification (PDQ), a meeting will be called by the TRB to

determine the tests that need to be performed. The general principle of testing product, under worst case conditions,

in accordance with the target specification; should be adhered to, to determine product capability at published

operating levels.