MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16

MIL-PRF-19500P

APPENDIX C

C.8.4 Continuous improvement. A comprehensive continuous improvement philosophy shall be fully deployed

throughout the company's organization. Manufacturers shall continuously improve in quality, service, and reliability

for all customers. This requirement does not replace the need for innovative improvements. Manufacturers shall

develop specific action plans for continuous improvement in processes that are most important to the customer once

those processes have demonstrated stability and acceptable capability. Continuous improvement means optimizing

the characteristics and parameters at a target value and reducing variation around that value.

C.8.4.1 Quality and productivity improvement. The manufacturer shall identify opportunities for quality and

productivity improvement and implement appropriate action plans. Some examples are:

Excessive variation.

Manufacturing yields.

Scrap, rework, and repair.

Optimization of tests.

Excessive cost of non-quality.

Machine down-time.

Machine set-up.

Cycle time.

Customer dissatisfaction, e.g., complaints, repairs, returns, mis-shipments, incomplete orders, customer

plant concerns, and warranty.

C.8.4.2 Measures and methodologies. The manufacturer shall demonstrate knowledge of the following measures

and methodologies and shall use those that are appropriate:

Capability indices.

Control charts.

Design of experiments.

Cost of quality.

Parts per million (PPM) analysis.

Problem solving.

Benchmarking.