MIL-PRF-19500P
APPENDIX D
D.2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein (except for related specification sheets), the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
D.3 REQUIREMENTS
D.3.1 Responsibility and authority.
D.3.1.1 Basic and contracted plant requirements. Devices furnished under this specification shall comply with the
performance requirements of section 3. herein, and shall be prepared for delivery in accordance with section 5.
herein. The verification system shall assure that the design, processing, assembly, inspection, and testing of
semiconductor devices comply with this specification and the specification sheet. The quality system shall
incorporate the applicable requirements of appendix E, appendix G, and appendix H.
D.3.1.1.1 Definition of a manufacturer. The manufacturer is the basic plant. For guidance on specific business
scenarios, details of implementation, financial commitment to this program, or interpretation of criteria herein, contact
the qualifying activity.
D.3.1.1.1.1 Basic plant. The basic plant is where wafer fabrication or device assembly is performed except the
corporate office may be listed as the basic plant whenever any wholly owned wafer fabrication or device assembly
plant is utilized for production. The basic plant has the responsibility for device critical interfaces, performance,
quality, and reliability. The manufacturer's designating symbol of the basic plant shall appear on the finished product.
Total ownership of the basic plant is required for listing and JAN branding. The basic plant shall be certified and
qualified by the qualifying activity. The basic plant shall ensure their subcontractors meet the requirements of MIL-
PRF-19500. The basic plant shall demonstrate control of all contracted plants to the qualifying activity.
D.3.1.1.1.2 Contracted plant. The basic plant may contract assembly or wafer fabrication provided control of the
contracted plant is demonstrated to the qualifying activity. A written agreement between a basic plant and a
contracted plant shall be required for all contracting scenarios. This agreement shall establish who is the basic plant
and the contracted plant. For any device type, a basic plant may not contract both assembly and wafer fabrication.
The contracted plant shall be certified by the qualifying activity. Qualification of assembled devices or wafers will be
the responsibility of the basic plant. Manufacturers may offer their certified line services to each other through the
contracted plant provisions.
D.3.1.1.1.2.1 Contracted assembly plant. The basic plant may contract assembly when control of the contracted
plant is demonstrated by the basic plant to the qualifying activity. The basic plant shall have a system to address the
applicable requirements of this appendix as determined by and approved by the qualifying activity. All contracted
processes shall be identified and FMEAs and control plans shall be implemented for assembly.
D.3.1.1.1.2.2 Contracted wafer fabrication. Contracted wafer fabrication facilities shall have wafer lot identification,
wafer lot process documentation, and wafer lot inspection. The wafer lot inspection shall ensure critical interface
requirements meet the semiconductor die properties as stated on DLA Land and Maritime Form 36D. A JANS
certified assembly facility may contract any JANS certified wafer fabrication facility for the purpose of qualifying JANS
devices.
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