MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16

MIL-PRF-19500P

APPENDIX D

D.3.1.5 Management review. The manufacturers management shall maintain an on going cognizance of the

status of the quality system (D.3.2) and the design control system (D.3.4) to ensure continuous suitability and

effectiveness in satisfying the requirements herein with periodic cross-functional reviews of these systems through a

Qualified Products Technical Review Board (QPTRB).

D.3.1.5.5 Qualified Products Technical Review Board (QPTRB) .

D.3.1.5.5.1 Organizational structure. The QPTRB is intended to be a cross-functional management and technical

group to ensure communication is established and maintained among representatives from: Management, device

design, technology development, wafer fabrication, assembly, test, production, and quality assurance. The members

of the QPTRB shall have the responsibility and authority to make decisions and the resources to implement these

decisions. Written procedures which will govern the operation of the QPTRB shall be maintained and updated.

Records of the QPTRB deliberations and decisions will be maintained and made available to the qualifying activity.

D.3.1.5.5.2 QPTRB duties. The QPTRB shall review the quality system at planned intervals to ensure continuing

stability, adequacy, and effectiveness. This review shall include assessing opportunities for improvement and the

need for changes to the quality system including quality policy and objectives.

D.3.1.5.5.2.1 QPTRB input:

a. Results of internal and external audits

b. Production yields.

c. Customer returns/feedback.

d. Corrective/preventive actions.

e. Failure analysis.

f. Design control / qualification initiatives.

g. Contract services.

h. Follow-up actions from previous management reviews.

i. Changes that could affect the quality system.

j. Recommendations for improvement.

D.3.1.5.5.2.2 QPTRB output:

a. The QPTRB shall document and communicate, when applicable, the results of the review.

b. The QPTRB shall set measurable quality objectives and monitor their progress towards meeting those

objectives.

c. The QPTRB shall review changes to all governing specifications and comment back to the preparing

activity: MIL-PRF-19500, MIL-STD-750, JEDEC and detail performance specification sheets.