MIL-PRF-19500P
APPENDIX D
Where limits are based on tolerances about a "approved design nominal", the nominal shall be stated in DLA Land
and Maritime Form 36D, and shall either be identified on the JANS fab traveler or on a JANS inspection record
submitted for approval by the qualifying activity.
D.3.9.5 Process monitor programs. Process monitor programs shall be established as referenced below, for
processes performed by the manufacturer. A fully implemented and approved SPC program (in accordance with
D.3.20.1) may replace all or portions of the process monitor programs with the approval of the qualifying activity.
These programs shall be documented and made available to the certification team for review. The implementing
procedures shall define sampled population frequency, sample size, reject criteria, allowable rework, and disposition
of failed batch/product. Investigative and corrective actions shall be established which address noted deficiencies.
A procedure is required for the traceability, recovery, and disposition of all units monitored since the last successful
test. All monitors shall provide for continual process improvement. Records of these monitors shall be available to
any (Government or military user) audit team for review. As a minimum, the process monitors shall include the
following, or equivalent, as approved by the qualifying activity:
a.
Die attachment: The type of die mounting method, die material, die mounting material, package material,
and mounting configuration shall be documented. The time, temperature, pressure, scrubbing,
cleanliness, and environment shall also be specified. The manufacturer shall monitor the die attach
integrity for all silicon transistors and case mounted diodes in accordance with test method 2017, 2076,
acoustical techniques, or thermal response test methods 3101, 3161, 3131, 3103, and 3104 of
MIL-STD-750 using the manufacturer's documented procedure. In addition, any die attached to a
package or substrate in a cavity device shall be monitored for die attach integrity. This procedure shall be
performed at each equipment set up for JANTX and JANTXV and, considered for other related factors
(such as change of operator, etc). This test shall be conducted on a minimum of two devices from each
die attach station at the start and finish of operator change, package type change, die size change, and
after every two hours of production for JANS. In the event that the die shear is less than the value shown
in test method 2017, or the test leaves less than 75 percent silicon remaining of die-to-header bond
surface, the output of the die attach station shall not be used until tests show that satisfactory operation
has been re-established. A procedure for the traceability, recovery, and disposition of all units bonded
since the last successful die attach integrity test is required. This procedure shall provide for sample size,
reject criteria, and disposition of failed lots. This test may be conducted on the same samples used for the
wire bond strength test.
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