MIL-PRF-19500P
APPENDIX D
j.
Glass evaluation: The manufacturer shall monitor all hard glass diodes, tungsten or moly, in accordance
with method 1057 of MIL-STD-750, condition B. Monitor may be performed at incoming inspection as
sample evaluation of each glass lot in accordance method 1057.
k.
Nickel particles: All manufacturers using nickel caps in the encapsulation process shall implement a cap
cleaning process. An in-line monitor shall be implemented to ensure the cleanliness of the nickel caps.
l.
Lead integrity: Manufacturers shall have procedures in place to monitor and ensure the integrity of the
lead. For axial devices this will apply to lead tension and fatigue in accordance with method 2036 of MIL-
STD-750 and for US devices it will apply to terminal tension only.
m. Wafer saw monitor: For all semiconductors, the manufacturer shall establish an effective monitoring
program for wafer saw operations. Saw monitoring shall be effective in preventing saw inflicted damage.
D.3.10 Inspection and testing.
D.3.10.1 Inspection of purchased materials. The manufacturer is responsible for assuring that all supplies and
services procured from suppliers conform to the contract. The manufacturer shall have a system which controls
inspection, storage, and handling of incoming materials, and periodic evaluation of material received. The system
may include verification of chemical, physical, and functional characteristics required by manufacturer drawings and
specifications. The manufacturer may utilize a certified supplier program to reduce or eliminate receiving inspection.
D.3.10.1.1 Certified supplier program. The capability of supplied material may be validated through a supplier
certification system. This program selects and monitors suppliers in order to guarantee that the supplied material will
meet and maintain required capability levels (e.g., Cpk, PPM).
D.3.10.2 In-process quality control. The manufacturer shall perform in-process inspections to the extent
necessary to assure product conformance to the end item specification. This shall include inspections and tests
which assure that the manufacturing processes are in a state of control as indicated in D.3.9 herein.
D.3.10.2.1 Manufacturer imposed tests. Any manufacturer imposed test(s) (e.g., gross and fine leak) conducted
prior to any qualification or conformance inspection, are to be performed on all subsequent lots until re-qualified. If
any manufacturer imposed tests detect a problem, the manufacturer shall submit all devices in the lot to those tests to
eliminate rejects and shall take steps to determine and eliminate the cause of failure (e.g., rough handling which has
produced gross leaks).
D.3.10.3 Testing and screening operations. Testing and screening operations may only be performed in a facility
which has received laboratory suitability approval from the qualifying activity for each MIL-STD-750 test method to be
employed. Each facility lists their approved methods and equipment on DLA Land and Maritime Form 36 (Test
Equipment List) or equivalent. The manufacturer shall document and update all burn-in socket capacity by plant
location on the applicable DLA Land and Maritime Form 36(s). The environmental conditions where testing and
screening are performed shall be maintained to assure compliance with the requirements of MIL-STD-750.
D.3.10.4 Final inspection and testing.
D.3.10.4.1 Qualification and conformance inspection. Qualification and conformance inspection shall be
performed as required by the specification sheet and herein at a facility which has received laboratory suitability
approval from the qualifying activity. The results of testing shall be reviewed and approved.
D.3.10.4.2 Visual inspection. Shall be performed on outgoing product prior to shipping. Visual examination shall
be in accordance with test method 2071 of MIL-STD-750. Sampling plans and acceptance are to be determined by
the supplier and approved by the qualifying activity.
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