MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX D

D.3.10.5 Inspection and test verification. The manufacturer shall verify that all inspection and testing required by

this specification and their quality plan (see D.3.2.4) has been accomplished as specified. Verification shall clearly

show whether the product passed or failed any requirement and shall contain sufficient detail to allow traceability to a

specific operator, test date, equipment, and program.

D.3.11 Control of inspection measuring and test equipment.

D.3.11.1 Test programs and setups. The test programs and setups used to sort, classify, and test for

MIL-PRF-19500 requirements are required to be traceable through each document control system to insure the

correct revision was used when testing MIL-PRF-19500 devices.

D.3.11.2 Test equipment maintenance and calibration system. Maintenance and calibration systems and the

frequency of scheduled actions, for gauges and test equipment, shall be established. The system may use

ANSI/NCSL Z540-1, or equivalent, as a guideline.

D.3.11.3 Conditions and methods of test. The general requirements, conditions and methods of test shall be in

accordance with MIL-STD-750.

D.3.11.4 Electrical test equipment verification. The manufacturer shall define and utilize a method (e.g.,

correlation samples, diagnosis routines) to verify the measurement and operation characteristics of the test

equipment when in use. In the event of verification of failure, the manufacturer shall utilize a procedure which will

determine the requirements for traceability, recovery, and when re-testing is required of all units tested since the last

successful verification.

D.3.12 Inspection and test status.

D.3.12.1 Inspection and test status. A system shall be maintained to insure that products are identified by their

test or inspection status. The system shall insure the separation of products that have been tested or inspected from

product that has not.

D.3.13 Control of nonconforming product. The manufacturer shall maintain a system which will prevent the

shipment or use of nonconforming product. The system shall provide for identification, segregation, and evaluation of

product, which does not conform to specified requirements at any point in the manufacturing and screening flow.

Devices or lots, which fail any specification or internal tests, procedures, and requirements above and beyond the

specification, except electrical selections, are not suitable for any JAN level. Lots failing electrical selections for any

JAN level which, 1) are above and beyond this specification and, 2) are intended to select a portion of a lot having

greater performance or reliability than the overall average performance or reliability of the lot other than through

statistical methods are not suitable for any JAN level.

D.3.13.1 Reworked product. Reworked or repaired product shall be re-inspected in accordance with the

appropriate procedures. All rework performed shall be documented and shall be attached to the original lot travelers

and be traceable and may be part of management review.

D.3.13.2 Rework provisions. All allowable rework on devices manufactured under this specification shall be

accomplished in accordance with the manufacturer's established procedures. Lots shall not exceed one rework for

any process except additional or rediffusion, photo resist strip, and recoat.

D.3.13.2.1 Wafer rework. For wafers, rework is limited to the following:

a. Additional etch to complete the process.

b. Photo resist strip and recoat.

c. Strip and redeposit of non-junction passivation.