MILPRF19500/114H
4.4 Conformance inspection. Conformance inspection shall be in accordance with MILPRF19500 and as
specified herein. Group A inspection shall be performed on each sublot.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MILPRF19500, and table I
herein. Electrical measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the tests and conditions
specified for subgroup testing in table EVIa (JANS) and table EVIb (JAN, JANTX, and JANTXV) of
MILPRF19500 and herein. Electrical measurements (end-points) shall be in accordance with table I, subgroup 2
herein. Delta measurements shall be in accordance with table II herein.
4.4.2.1 Product assurance level JANS (table EVIa of MILPRF19500).
Subgroup
Method
Condition
B4
1037
2,000 cycles. See Paragraph 4.5.8.
IZ = column 7 (IZM) of table III herein for 96 hours, TA = +125°C or adjusted, as
B5
1027
required, to give an average lot TJ = +225°C.
RΘJC = 2.0°C/W maximum TC = 30 ±3°C. For purposes of this test "junction to case"
B6
4081
shall be used in lieu of "junction to lead" and RΘJC shall be used in lieu of RΘJL. The
case shall be the reference point for calculation of junction to case thermal resistance
(RΘJC). The mounting arrangement shall be with heat sink to case.
4.4.2.2 Product assurance levels JAN, JANTX, and JANTXV (table EVIb of MILPRF19500).
Subgroup
Method
Condition
B2
4066
IZSM = column 9 of table III herein. Subgroup 2 (except forward voltage test) and
subgroup 3 of table I herein; ĆIR1 = 100 percent of initial value or 2 µA dc, whichever is
greater, ĆVZ = ±1 percent of initial value.
IZ = column 4 of table III herein, adjust TA, mounting, or both to achieve
B3
1027
TC = 150 ±5°C.
B3
1037
2,000 cycles. See paragraph 4.5.8.
RΘJC = 2.0°C/W maximum TC = 30 ±3°C. For purposes of this test "junction to case"
B5
4081
shall be used in lieu of "junction to lead" and RΘJC shall be used in lieu of RΘJL. The
case shall be the reference point for calculation of junction to case thermal resistance
(RΘJC). The mounting arrangement shall be with heat sink to case.
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