INCH-POUND
The documentation and process conversion measures
MIL-PRF-19500/144R
necessary to comply with this document shall be
1 July 2014
completed by 1 October 2014.
SUPERSEDING
MIL-PRF-19500/144P
19 October 2012
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING, TYPES 1N4454-1, 1N4454UR-1, 1N4454UB,
1N4454UBCA, 1N4454UBCC, 1N4454UBD, 1N3064, 1N4532, JAN, JANTX, JANTXV, JANHC, AND JANKC
Device types 1N3064 and 1N4532 are inactive for new design (see 6.4).
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein
shall consist of this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for silicon, diffused, switching diodes. Three
levels of product assurance are provided for each device type as specified in MIL-PRF-19500.
1.2 Physical dimensions. See figures 1 (axial), 2 (DO-213AA), 3 (UB), and 4 (JANHCA and JANKCA).
1.3 Maximum ratings. Unless otherwise specified TA = +25°C.
RθJL
RθJEC
RθJA(PCB)
RθJSP
VBR
VRWM IO(PCB) IFSM
TJ &
Type
TA = 8.3ms
TSTG
L = 3/8 inch (UR)
(2) (3) (4)
(UB)
(9.53 mm)
(3)
(3) (4)
75°C
(3)
(1) (2)
°C
°C/W
°C/W
°C/W
°C/W
V dc
V (pk)
mA
A (pk)
1N4454-1,
-55 to
250
100
325
75
50
200
2
1N4454UR-1
+175
(leaded)
(UR)
1N4454UB,
1N4454UBCA,1
-55 to
120
N4454UBCC,1N
+200
(UB)
4454UBD
1N3064
-55 to
250
325
+175
(leaded)
1N4532
(1) For temperature-current derating curves, see figures 5 and 6.
(2) TA = +75°C for both axial and metal electrode leadless face diodes (MELF) (UR) on printed circuit board (PCB),
PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, in still air; pads for (UR) = .061 inch (1.55 mm)
x.105 inch (2.67 mm); pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch (25.4
mm) long, lead length L ≤ .187 inch (≤ 4.75 mm); RθJA with a defined PCB thermal resistance condition included,
is measured at IO = 200 mA dc.
(3) See figures 7, 8, and 9 for thermal impedance curves.
(4) RθJSP refers to thermal resistance from junction to the solder pads of the UB package.
Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dla.mil. Since contact
information can change, you may want to verify the currency of this address information using the ASSIST
Online database at https://assist.dla.mil.
AMSC N/A
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