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MIL-PRF-19500-144 Semiconductor Device, Diode, Silicon, Switching, Types 1N4454-1, 1N4454Ur-1, 1N4454Ub, 1N4454Ubca, 1N4454Ubcc, 1N4454Ubd, 1N3064, 1N4532, Jan, Jantx, Jantxv, Janhc, And JankcThis specification covers the performance requirements for silicon, diffused, switching diodes. Three levels of product assurance are provided for each device type as specified in MIL-PRF-19500.

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MIL-PRF-19500/144R
Dimensions
Ltr
Inches
Millimeters
Min
Max
Min
Max
A
.014
.018
.360
.460
B
.005
.007
.120
.180
C
.008
.012
0.20
0.30
NOTES:
1. Dimensions are in inches. Millimeters are given for general information only.
2. Element evaluation accomplished utilizing TO-5 package.
3. The physical characteristics of the die are:
Metallization:
Top (anode): Al
Back (cathode): Au
Al thickness: 25,000 Å minimum.
Gold thickness: 4,000 Å minimum.
Chip thickness: .010 inches (0.25 mm) ±.002 inches (0.05 mm).
FIGURE 4. Physical dimensions, JANHCA and JANKCA die.
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