MIL-PRF-19500/162E
3.7 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.8 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and
3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a.
Qualification inspection (see 4.2).
Screening (see 4.3).
b.
Conformance inspection (see 4.4).
c.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein. Tests in either polarity shall be sufficient to obtain qualification approval of both polarities.
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with appendix E, table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screening (see appendix
Measurement
E, table E-IV of
JANTX and JANTXV levels
(1) 3b
Surge, (see 4.3.1)
(1) 3c
Thermal impedance (see 4.3.2)
9
Not applicable
11
IR1 and VF
12
See 4.3.3
Subgroup 2 of table I herein: ĆIR1 ≤ 100 percent of initial reading or
13
±5.0 µA dc, whichever is greater, ĆVF ≤ ±0.1 V dc.
(1) Surge shall precede thermal impedance and shall be performed any time after sealing provided
temperature cycling is performed in accordance with MIL-PRF-19500, screen 3 prior to this
thermal test.
4.3.1 Surge current. Surge current, see method 4066 of MIL-STD-750. IO = 0; VRM(W) = 0; IFSM = 100 A; six
surges; TA = room ambient as defined in the general requirements of 4.5 of MIL-STD-750. One surge per minute
maximum. tp = 8.3 ms.
4.3.2 Thermal impedance ZθJX measurements for screening. The ZθJX measurements shall be performed in
accordance with method 3101 of MIL-STD-750. The maximum limit and conditions for ZθJX in screening (appendix E,
table E-IV of MIL-PRF-19500) shall be derived by each vendor by means of process control of actual measurements
which characterizes the die attach process. When three lot date codes have exhibited control, the data from these
three lots will be used to establish a fixed screening limit (not to exceed the group A limit). Once a fixed limit has
been established, monitor all future sealing lots using a sample from each lot.
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