MIL-PRF-19500/225K
4.4.2.1 Group B inspection, JAN, JANTX, and JANTXV.
*
Step
Method
Condition
1
1026
Steady-state life: Test condition B, 1,000 hours minimum, VCB = 10 V dc, power shall
be applied to achieve TJ = +150°C minimum using a minimum of PD = 75 percent of
maximum rated PT as defined in 1.3. n = 45 devices, c = 0. The sample size may be
increased and the test time decreased so long as the devices are stressed for a total of
45,000 device hours minimum, and the actual time of test is a minimum of 340 hours.
Blocking life, TA = 150°C, VCB = 80 percent of rated voltage, without going over the
*
2
1048
maximum rated VCE, 48 hours minimum. n = 45 devices, c = 0.
High-temperature life (non-operating), t = 340 hours, TA = +200°C. n = 22, c = 0.
3
1032
* 4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following
requirements:
*
a. For JAN, JANTX, and JANTXV samples shall be selected randomly from a minimum of three wafers (or from
each wafer in the lot) from each wafer lot.
*
b. Shall be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2,
conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high
temperature, the samples for life test ( group B for JAN, JANTX, and JANTXV) may be pulled prior to the
application of final lead finish.
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall be in
accordance with table I, group A, subgroup 2 herein.
Method
Condition
Subgroup
C2
2036
Lead fatigue: Test condition E.
RθJA and RθJC only, as applicable (see 1.3 and 4.3.2).
C5
3131
*
C6
Not applicable.
4.4.3.3 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any
inspection lot containing the intended package type and lead finish procured to the same specification which is
submitted to and passes table I tests herein for conformance inspection. When the final lead finish is solder or any
plating prone to oxidation at high temperature, the samples for C6 life test may be pulled prior to the application of
final lead finish. Testing of a subgroup using a single device type enclosed in the intended package type shall be
considered as complying with the requirements for that subgroup.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500 and as specified in table II herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein.
4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
6
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