MIL-PRF-19500/270J
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limits
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
2071
n = 45 devices, c = 0
Visual and mechanical
examination 3/
Solderability 3/ 4/
n = 15 leads, c = 0
2026
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Heremetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical measurements, 4/
Table I, subgroup 2
Precondition TA = +250°C at t = 24 hrs
Bond strength 3/ 4/
2037
or TA = 300°C at t = 2 hrs
n = 11 wires, c = 0
Subgroup 2
°C/W
Thermal impedance
3131
See 4.3.2
ZθJX
µA dc
10
Collector to base cutoff
3036
Bias condition D, VCB = 100 V dc
ICBO1
current
Breakdown voltage,
80
V dc
3011
V(BR)CER
Bias condition B, IC = 10 mA dc
RBE ≤ 10 ohms, pulsed (see 4.5.1)
collector to emitter
Breakdown voltage,
3011
60
V dc
Bias condition D, IC = 30 mA dc
V(BR)CEO
collector to emitter
pulsed (see 4.5.1)
µA dc
Emitter to base cutoff
3061
10
Bias condition D, VEB = 7 V dc
IEBO1
current
Collector to base cutoff
3036
2
nA dc
Bias condition D; VCB = 80 V dc
ICBO2
current
Emitter to base cutoff
3061
2
nA dc
Bias condition D, VEB = 5 V dc
IEBO2
current
Saturation voltage and
3071
0.3
V dc
IC = 50 mA dc; IB = 5 mA dc
VCE(sat)
resistance
Base emitter voltage
3066
0.9
V dc
VBE(sat)
Test condition A, IC = 50 mA dc;
(saturated)
IB = 5 mA dc
See footnotes at end of table.
11
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