MIL-PRF-19500/287G
3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in
MIL-PRF-19500, and on figure 1 herein.
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and
herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.5 Marking. Devices shall be marked in accordance with MIL-PRF-19500. At the option of the manufacturer,
the marking of the country of origin may be omitted from the body of the transistor.
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I.
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality
and shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4, and tables I, II, and III).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the associated specification that did not request the
performance of table III tests, the tests specified in table III herein shall be performed by the first inspection lot of
this revision to maintain qualification.
* 4.3 Screening. Screening shall be in accordance with table E-IV of MIL-PRF-19500 and as specified herein.
The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of
table I herein shall not be acceptable.
Screen (see table E-IV of
Measurement
MIL-PRF-19500)
JANTX levels
(1) 3
Thermal impedance, method 3131 of MIL-STD-750
9
Not applicable
ICES1 and hFE1
11
12
See 4.3.1
Subgroup 2 of table I herein, ΔICES1 = 100 percent of initial value or 50 nA dc,
13
whichever is greater. ΔhFE1 = ±20 percent of initial value.
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be
repeated in screening requirements.
4
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