MIL-PRF-19500/287G
4.4.2.2 Group B sample selection. Samples selected from group B inspection shall meet all of the following
requirements:
a. For JAN and JANTX, samples shall be selected randomly from a minimum of three wafers (or from each
wafer in the lot) from each wafer lot. See MIL-PRF-19500.
b. Shall be chosen from an inspection lot that has been submitted to and passed group A, subgroup 2,
conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high
temperature, the samples for life test (group B for JAN and JANTX) may be pulled prior to the application
of final lead finish.
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified
for subgroup testing in table E-VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall
be in accordance with table I, subgroup 2 herein. Delta measurements shall be in accordance with table II herein.
Subgroup
Method
Condition
C2
1056
Thermal shock, test condition A.
C2
2036
Terminal strength, test condition E.
C5
3131
RθJA and RθJC only (see 1.3).
C6
Not applicable.
* 4.4.3.1 Group C sample selection. Samples for steps in group C shall be chosen at random from any
inspection lot containing the intended package type and lead finish procured to the same specification which is
submitted to and passes table I tests for conformance inspection. Testing of a subgroup using a single device
type enclosed in the intended package type shall be considered as complying with the requirements for that
subgroup.
4.4.4 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the associated specification that did not request the
performance of table III tests, the tests specified in table III herein shall be performed by the first inspection lot of
this revision to maintain qualification.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as
follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of
MIL-STD-750.
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