MIL-PRF-19500/290P
TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Limit
Unit
Symbol
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
n = 45 devices, c = 0
examination 3/
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Hermetic seal 4/ 6/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Table I, subgroup 2
Electrical measurements 4/
Bond strength 3/ 4/
2037
Precondition
TA = +250°C at t = 24 hours or
TA = +300°C at t = 2 hours
n = 11 wires, c = 0
Decap internal visual (design
2075
n = 4 devices, c = 0
verification) 4/
Subgroup 2
°C/W
Thermal impedance
3131
See 4.3.2
ZθJX
µA dc
10
Collector to base cutoff current
3036
VCB = 60 V dc
ICBO1
µA dc
Emitter to base cutoff current
3061
10
VEB = 5 V dc
IEBO1
3011
Breakdown voltage,
V(BR)CEO
Bias condition D; IC = 10 mA dc,
collector to emitter
pulsed (see 4.5.1)
40
2N2904, 2N2905
V dc
60
2N2904A, 2N2905A
V dc
60
2N2904AL, 2N2905AL
V dc
Collector to base cutoff current
3036
Bias condition D; VCB = 50 V dc
ICBO2
2N2904, 2N2905
20
nA dc
2N2904A, 2N2905A
10
nA dc
2N2904AL, 2N2905AL
10
nA dc
Emitter to base
3061
50
nA dc
Bias condition D; VEB = 3.5 V dc
IEBO2
cutoff current
See footnotes at end of table.
10
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