MIL-PRF-19500/347B
3. REQUIREMENTS
* 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
* 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500.
a. Total control charge. QT when a transistor is held in a conductive state by a current, IB, a charge QS is
stored in the device when operating in the active region. A charge QT may be stored on an external
capacitor C to neutralize the effect of the internal charge, QS when the transistor is turned off (see 4.5.2).
b. Base leakage current. (IBL) is defined as base leakage current with both junctions reverse biased. IC is
always ≤ IBL for VBE ≥ VT. (VBE is off condition base bias; VT is base voltage at threshold of conduction.
* 3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in
MIL-PRF-19500, and on Error! Reference source not found.. The suffix "S" is used on devices which have 0.5 inch
minimum to 0.75 inch maximum lead length.
* 3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see Error! Reference
source not found.).
3.4.2 Terminal-lead length. Terminal lead length(s) other than that specified in figure 1 may be furnished
when so stipulated in the contract or order. Where other lead lengths are required and provided, it shall not be
construed as adversely affecting the qualified-product status of the device, or applicable JAN marking (see 6.2).
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.4.1 'S' suffix marking. The 'S' suffix shall be used on devices meeting the 0.5 inch minimum to 0.75 inch
maximum lead length requirement.
* 3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
* 3.6 Electrical test requirements. The electrical test requirements shall be as specified in table I.
* 3.7 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
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