MIL-PRF-19500/369H
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500 and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANTX and JANTXV levels
(1) 3c
Thermal impedance, see 4.3.2.
9
Not applicable.
11
ICEX1 and hFE3 .
12
Burn-in (see 4.3.1).
ĆICEX1 = 100 percent of initial value
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or 2 µA whichever is greater.
ĆhFE3 = ±25 percent
Subgroup 2 table I herein.
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be
repeated in screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:
a. TA = +30°C ±5°C.
b. VCB > 100 V dc.
c. TJ = +187.5°C ±12.5°C.
NOTE: No heatsink or forced air-cooling on the devices shall be permitted.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with
method 3161 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where
appropriate). Measurement delay time (tMD) = 70 µs max. See table II, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein. Electrical measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
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