MIL-PRF-19500/371H
* 4.3 Screening (JANTX and JANTXV level). Screening shall be in accordance with table E-IV of MIL-PRF-19500,
and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that
exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANTX and JANTXV only
Thermal impedance (transient), method
(1)
3c
3131 of MIL-STD-750 (see 4.3.2)
10
VCB = 80 percent of maximum rated
11
hFE2 and ICEX1
12
See 4.3.1
ĆICEX1 = 100 percent of initial value or
13
2 µA dc, whichever is greater.
ĆhFE2 = 25 percent of initial value;
subgroup 2 of table I herein
*
17
For TO-254AA packages: Method 1081 of
MIL-STD-750 (see 4.3.3), Endpoints:
Subgroup 2 of table I herein.
(1)
Thermal impedance limits shall not exceed as shown in figures 7, 8, and 9. This test shall be performed
anytime after temperature cycling, screen 3a; and does not need to be repeated in screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: TA = room ambient as defined in the
general requirements of 4.5 of MIL-STD-750; VCB = 10-30 V dc, TJ = +175°C minimum.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tMD, tSW, (and VH where
appropriate). The thermal impedance limit used in screen 3c of 4.3 herein and table I shall comply with the thermal
impedance graph in figure 7, 8, and 9 (less than or equal to the curve value at the same tH time) and shall be less
than the process determined statistical maximum limit as outlined in method 3131.
7
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