MIL-PRF-19500-394 Semiconductor Device, Transistor, Npn, Silicon, Power Switching, Types: 2N4150, 2N5237, 2N5238, 2N4150S, 2N5237S, And 2N5238S, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhca, Janhcb, Jankca, Jankcb, Jankcm, Jankcd, Jankcp, Jankcl, Jankcr, Jankcf, Jankcg,And JankchThis specification covers the performance requirements for NPN, silicon, low-power, high voltage transistors. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500 and two levels of product assurance are provided for each unencapsulated device type. Provisions for radiation hardness assurance \(RHA\) to four radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels. RHA level designators "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements.

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MIL-PRF-19500/394N

NOTES:

.128 x .128 inch �.002 inch (3.25 x 3.25 �0.051 mm).

1. Chip size:

2. Chip thickness:

.015 inch (0.254 mm) nominal.

3. Top metal:

Aluminum 30,000� minimum, 33,000� nominal.

4. Back metal:

Gold 3,500� minimum, 5,000� nominal.

5. Backside:

Collector.

6. Bonding pad:

B = .052 x .012 inch (1.321 x 0.305 mm), E = .084 x .012 inch (2.134 x 0.305 mm).

* FIGURE 2. JANHC and JANKC A-version die dimensions.