MIL-PRF-19500/407E
3.6 Electrical test requirements. The electrical test requirements shall be as specified in table I.
3.7 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4 and tables I and II).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
* 4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In case
qualification was awarded to a prior revision of the specification sheet that did not request the performance of table III
tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on the first
inspection lot of this revision to maintain qualification.
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500 and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANTX, JANTXV levels only
(1) 3c
Thermal impedance (transient), method 3131 of MIL-STD-750, see
4.3.2
9
Not applicable
11
ICEX1, hFE2
12
See 4.3.1
13
Subgroup 2 of table I herein.
ĆICEX1 = 100 percent or 100 µA dc whichever is greater,
ĆhFE2 = ±25 percent of initial value.
(1)
Shall be performed anytime after temperature cycling, screen 3a, and does not need to be repeated in
screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: TJ = +187.5°C ±12.5°C, VCB = 10 - 30 V
dc. NOTE: No heat sink or forced air cooling on the devices shall be permitted.
4
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