MIL-PRF-19500/413F
* 4.4.2.1 Group B inspection, table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup Method
Condition
For solder die attach: Intermittent operation life; 2,000 cycles; VCB ≥ 10 V dc; TA ≤ +35°C
B3
1037
For eutectic die attach: TA ≤ +35°C, VCB ≥ 10 V dc; adjust PT to achieve TJ = +175°C
B3
1027
minimum.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein. Delta requirements shall be in accordance with table II herein.
Subgroup Method
Condition
C2
2036
Test condition A, weight = 10 lbs., t = 15 s.
See 4.3.2, RθJC = 1.17°C/W.
C5
3131
For solder die attach: Intermittent operation life; 6,000 cycles; VCB ≥ 10 V dc; TA ≤ +35°C
C6
1037
For eutectic die attach: TA ≤ +35°C, VCB ≥ 10 V dc; adjust PT to achieve TJ = +175°C
C6
1027
minimum.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table E-IX of MIL-PRF-19500 and as specified herein. Electrical measurements
(end-points) shall be in accordance with table I, subgroup 2 herein. Delta requirements shall be in accordance with
table II herein.
4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.
6
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business