The documentation and process conversion
INCH-POUND
measures necessary to comply with this revision
shall be completed by 6 December 2013.
MIL-PRF-19500/420M
6 September 2013
SUPERSEDING
MIL-PRF-19500/420L
27 June 2008
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, POWER, RECTIFIER,
TYPES 1N5550 THROUGH 1N5554, 1N5550US THROUGH 1N5554US,
JAN, JANTX, JANTXV, JANS, JANHCA, JANHCB, JANHCC, JANHCD,
JANHCE, JANKCA, JANKCD, AND JANKCE
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for silicon, general purpose, semiconductor
diodes. The diode is non cavity double plug construction, with high temperature metallurgical bonds (category 1)
between both sides of the silicon die and terminal pins. Four levels of product assurance are provided for each
encapsulated device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for each
unencapsulated device type.
1.2 Physical dimensions. See figure 1 (axial lead) for 1N5550 through 1N5554, figure 2 for 1N5550US through
1.3 Maximum ratings. Unless otherwise specified, TA= +25°C and ratings apply to all case outlines.
1.3.1 Ratings applicable to all types. TSTG = TJ = -65°C to +175°C.
* 1.3.2 Ratings applicable to individual types.
Col. 1
Col. 2
Col. 3
Col. 5
Col. 6
Col. 7
Col. 8
Col. 9
Col. 4
Type
VRWM
IO(L)
IFSM
RθJL at
RθJEC at
IO2
IO3
TL = +30°C;
IO = 2 A dc
L = .375
L=0
RθJX
TA =
TA =
(1)
L = .375 inch
tp = 8.3 ms
inch
inch
100°C
55°C max
(1)
VRWM =
(9.52
(0 mm)
(3)
(3) (4)
TEC =130°C
Rated
mm)
(6)
(2) (3)
TA = 55°C
(5)
°C /W
°C /W
°C /W
V dc
A
A
A dc
A(pk)
1N5550, US
200
5
3.0
2.0
100
22
6.5
47
1N5551, US
400
5
3.0
2.0
100
22
6.5
47
1N5552, US
600
5
3.0
2.0
100
22
6.5
47
1N5553, US
800
5
3.0
2.0
100
22
6.5
47
1N5554, US 1,000
5
3.0
2.0
100
22
6.5
47
See notes on next page.
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dla.mil. Since contact
information can change, you may want to verify the currency of this address information using the ASSIST
Online database at https://assist.dla.mil/.
AMSC N/A
FSC 5961
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