MIL-PRF-19500-423 Semiconductor Device, Transistor, Npn, Silicon, Switching, Types 2N5581 And 2N5582, Jan, Jantx, And JantxvThis specification covers the performance requirements for NPN, silicon, switching transistors. Three levels of product assurance are provided for each device type as specified in MIL-PRF-19500.

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MIL-PRF-19500/423G

* 4.3 Screening (JANTX, and JANTXV levels only). Screening shall be in accordance with table E-IV of

MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I

herein. Devices that exceed the limits of table I herein shall not be acceptable.

Measurement

Screen (see table IV of

MIL-PRF-19500)

JANTX and JANTXV level

(1) 3c

Thermal impedance (see 4.3.2)

Not applicable

48 hours minimum

ICBO2; hFE4

Subgroups 2 of table I herein; ĆICBO2 = 100 percent of initial value or

5 nA dc, whichever is greater. ĆhFE4 = �15 percent

(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be repeated in

screening requirements.

4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCB = 10 - 30 V dc. Power shall be

applied to achieve TJ = +135�C minimum using a minimum PD = 75 percent of PT maximum rated as defined in 1.3.

With approval of the qualifying activity and preparing activity, alternate burn-in criteria (hours, bias conditions, TJ, and

mounting conditions) may be used for JANTX and JANTXV quality levels. A justification demonstrating equivalence

is required. In addition, the manufacturing site's burn-in data and performance history will be essential criteria for

burn-in modification approval.

4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with

method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW (VC and VH where

appropriate). Measurement delay time (tMD) = 70 �s max. See table II, group E, subgroup 4 herein.

4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as

specified herein. If alternate screening is being performed in accordance with MIL-PRF-19500, a sample of screened

devices shall be submitted to and pass the requirements of subgroup 1 and 2, of table I herein, inspection only (table

E-VIb, group B, subgroup 1 is not required to be performed since solderability and resistance to solvents testing is

performed in table I herein.

4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I

herein.