MIL-PRF-19500/423G
TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limit
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Solderability 3/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/
Temp cycling 3/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Hermetic seal
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Table I, subgroup 2
Electrical measurements
Bond strength 3/
2037
Precondition
TA = +250°C at t = 24 hours or
TA = +300°C at t = 2 hours
n = 11 wires, c = 0
Decap internal visual
2075
n = 4 devices, c = 0
(design verification)
Subgroup 2
°C/W
Thermal impedance
3131
See 4.3.2
ZθJX
Collector to base cutoff
µA dc
current
3036
10
Bias condition D; VCB = 75 V dc
ICBO1
µA dc
Emitter to base cutoff
3061
10
Bias condition D; VEB = 6 V dc
IEBO1
current
Breakdown voltage collector
3011
Bias condition D; IC = 10 mA dc pulsed
50
V dc
V(BR)CEO
to emitter
(see 4.5.1)
Collector to base cutoff
3036
10
nA dc
Bias condition D; VCB = 60 V dc
ICBO2
current
Emitter to base cutoff
3061
10
nA dc
Bias condition D; VEB = 4 V dc
IEBO2
current
See footnotes at end of table.
8
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