MIL-PRF-19500/430C
* 3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
* 4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
* 4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table III tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500), and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
JANTX and JANTXV levels
9
Not applicable.
10
Not applicable.
IDSS, IGSS, |yfs|
11
12
See 4.3.1.
13
Subgroup 2 of table I herein;
ĆIGSS = 0.1 nA dc or 100 percent of initial
value, whichever is greater.
|Ćyfs| = ±20 percent of initial value.
ĆIDSS = 10 percent of initial value.
4.3.1 Power burn-in. Power burn-in conditions are in accordance with MIL-STD-750, method 1039, condition A
and as follows: TA = +175°C; VGS = -40 V dc; VDS = 0.
* 4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein. Alternate flow is allowed for quality conformance inspection in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I
herein.
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