The documentation and process conversion
INCHPOUND
measures necessary to comply with this revision
MILPRF19500/502G
shall be completed by 28 May 2014.
28 February 2014
SUPERSEDING
MILPRF19500/502F
12 October 2012
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER DARLINGTON,
TYPES 2N6058 AND 2N6059, JAN, JANTX, AND JANTXV
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MILPRF19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for NPN silicon power Darlington transistors.
Three levels of product assurance are provided for each encapsulated device type as specified in MILPRF19500.
1.2 Physical dimensions. The device package style is TO204AA (similar to TO3) in accordance with figure 1.
1.3 Maximum ratings. Unless otherwise specified, TC = +25°C.
PT
VCBO
VCEO
VEBO
IC
IB
TJ and TSTG
Types
TC = +25°C (1)
TC = +100°C
°C
W
W
V dc
V dc
V dc
A dc
A dc
2N6058
150
75
80
80
5
12
0.2
55 to +175
2N6059
150
75
100
100
5
12
0.2
55 to +175
(1) Derate linearly at 1.00 W/°C above TC > +25°C.
Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime ATTN:
VAC, P.O. Box 3990, Columbus, OH 432183990, or emailed to semiconductor@dla.mil. Since contact
information can change, you may want to verify the currency of this address information using the ASSIST
Online database at https://assist.dla.mil.
AMSC N/A
FSC 5961
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