MIL-PRF-19500/514D
4.3 Screening. Screening shall be in accordance with MIL-PRF-19500 (table E-IV), and as specified herein. The
following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I
herein shall not be acceptable.
Screen (see table E-IV
Measurements
of MIL-PRF-19500)
JANTX and JANTXV levels
Thermal impedance (see 4.3.2).
(1) 3c
9
Not applicable
11
ICEX1 and hFE2
See 4.3.1
12
13
Subgroup 2 of table I herein;
ĆICEX1 = 100 percent of initial value or 1 µA dc,
whichever is greater.
ĆhFE2 = ± 25 percent of initial value.
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be
repeated in screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are TJ = +187.5°C, ±12.5°C; VCB ≥ 20 V dc.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein. Electrical measurements (end-points) shall be in accordance with applicable inspections of table I, subgroup
2 herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500. End-point electrical measurements
shall be in accordance with table I, subgroup 2 herein. Delta measurements shall be in accordance with table II
herein.
Subgroup
Method
Condition
VCE ≥ 20 V dc; TJ = 187.5°C, ± 12.5°C.
B3
1027
or
VCB ≥ 20 V dc; ĆTJ =between cycles ≥ +100°C; ton
= toff ≥ 1 minute.
B3
1037
5
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