MIL-PRF-19500/518D
* 4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500 and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANTX and JANTXV levels
(1) 3c
Thermal impedance (see 4.3.2).
ICEX1 and hFE2.
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See 4.3.1.
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Subgroup 2 of table I herein.
ΔICEX1 = 100 percent of initial value or
1 μA dc, whichever is greater; ΔhFE2 =
25 percent of initial value.
(1)
Shall be performed anytime after temperature cycling, screen 3a; and does not need to
be repeated in screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: TJ = +187.5°C ±12.5°C, VCB ≥
10 V dc, TA ≤ +35°C.
* 4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
Measurement delay time (tMD) = 70 μs max. See table II, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein. Electrical measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
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