MIL-PRF-19500/518D
* TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Limits
Symbol
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
2071
n = 45 devices, c = 0
Visual and mechanical 3/
examination
Solderability 3/
2026
n = 15 leads, c = 0
Resistance to 3/ 4/
1022
n = 15 devices, c = 0
solvent
Temp cycling 3/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
n = 22 devices, c = 0
1071
Hermetic seal
Fine leak
Gross leak
Electrical measurements
Group A, subgroup 2
Bond strength 3/
2037
Precondition TA = +250°C at t = 24
hrs or TA = +300°C at t = 2 hrs,
n = 11 wires, c = 0
Subgroup 2
*
ZθJC
Thermal impedance 5/
3131
See 4.3.2
°C/W
3011
Bias condition D, IC = 100 mA dc,
V(BR)CEO
Collector to emitter
breakdown voltage
pulsed (see 4.5.1)
2N3766
60
V dc
2N3767
80
V dc
μA dc
ICEO
500
3041
Bias condition D,
Collector to emitter
cutoff current
VCE = 60 V dc
2N3766
2N3767
VCE = 80 V dc
μA dc
3061
Bias condition D, VEB = 6 V dc
IEBO
500
Emitter-base
cutoff current
Collector to emitter
3041
Bias condition A,
ICEX1
cutoff current
VBE = 1.5 V dc,
μA dc
2N3766
10
VCE = 80 V dc
μA dc
2N3767
10
VCE = 100 V dc
Collector to base
3036
Bias condition D,
ICBO
cutoff current
μA dc
2N3766
VCB = 80 V dc
10
μA dc
2N3767
10
VCB = 100 V dc
See footnotes at end of table.
8
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