MIL-PRF-19500/527E
*
4.4.2.1 Group B inspection, appendix E, table E-VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500
Method
Conditions
Subgroup
For solder die attach: VCB ≥ 10 V dc, 2,000 cycles, TA ≤ 35°C.
B3
1037
For eutectic die attach: VCB ≥ 10 V dc, TA ≤ 35°C adjust PT to achieve TJ = 150°C
B3
1026
minimum.
TSTG = + 175°C
B6
1032
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500. Electrical measurements (end-points) shall be in accordance with
table I, subgroup 2 herein.
*
4.4.3.1 Group C inspection, appendix E, table E-VII of MIL-PRF-19500.
Method
Conditions
Subgroup
C2
2036
Test condition A, weight = 10 pounds, t = 15 s.
RθJC = 1.76°C/W. See 4.3.2 herein.
*
C5
3131
For solder die attach: VCB ≥ 10 V dc, 6,000 cycles, TA ≤ 35°C.
C6
1037
For eutectic die attach: VCB ≥ 10 V dc, TA ≤ 35°C adjust PT to achieve TJ = 150°C
C6
1026
minimum.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500 and as specified in table II herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2.
4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of
MIL-STD-750.
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