MIL-PRF-19500/551G
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
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Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
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Test Methods for Semiconductor Devices.
* (Copies of these documents are available online at https://quicksearch.dla.mil/).
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500 and as follows:
IP ............ Maximum peak pulse current at a specified condition.
I(BR) ....... Reverse breakdown current at a specified condition.
TEC ........ End-cap temperature.
3.4 Interface requirements and physical dimensions. The interface requirements and physical dimensions shall be
as specified in MIL-PRF-19500 and on figures 1, 2, and 3 herein. The surface mount devices (US and URS) shall be
structurally identical to the "non US" version except for lead attachment.
3.4.1 Construction. These devices shall be constructed utilizing metallurgically bonded noncavity double plug
construction between both sides of the silicon die and the terminal pins.
3.4.2 Lead finish. Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein. Where
a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.4.3. Metallurgical bond construction. Devices shall be metallurgically bonded, thermally matched, noncavity-
double plug construction in accordance with MIL-PRF-19500, and herein.
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.
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