MIL-PRF-19500/564H
4.3.1 Screening (JANHC and JANKC). Screening of die shall be in accordance with MIL-PRF-19500. As a
minimum, die shall be 100-percent probed in accordance with table I, subgroup 2.
4.3.2 Gate stress test. Apply VGS = 30 V minimum for t = 250 µs minimum.
4.3.3 Unclamped inductive switching.
a.
Peak current (ID) .................................. Rated ID1.
b.
Peak gate voltage (VGS) ...................... -10 V dc.
Gate to source resistor (RGS)............... 25 RGS 200 .
c.
Initial case temperature (TC) ................ +25C +10C, -5C.
d.
Inductance (L)...................................... 100 H 10 percent.
e.
f.
Number of pulses to be applied ........... 1 pulse minimum.
g.
Pulse repetition rate............................. None.
* 4.3.4 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3161 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
Measurement delay time (tMD) = 70 s max. See table II, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500. Alternate flow
is allowed for conformance inspection in accordance with figure 4 of MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I
herein. Electrical measurements (end-points) shall be in accordance with the inspections of table I, subgroup 2
herein.
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