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MIL-PRF-19500-567 Semiconductor Device, Diode, Silicon, Schottky Barrier, Fast Recovery, Type 1N6492, 1N6492U4, Jan, Jantx, Jantxv, And JansThis specification covers the performance requirements for silicon, fast recovery, Schottky barrier, semiconductor diode. Four levels of product assurance are provided for each device type as specified in

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MIL-PRF-19500/567E
* 4.3 Screening (JANS, JANTXV, and JANTX levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen
Measurement
(see table E-IV of
JANS level
JANTX and JANTXV levels
(1) 3c
Thermal impedance (see 4.3.2).
Thermal impedance (see 4.3.2).
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Reverse energy test (see 4.5.2) VFM2 , IRM1.
Not applicable.
TC = +130°C.
TC = +130°C.
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Reverse energy test (see 4.5.2),
Reverse energy test (see 4.5.2),
ĆVFM2 ±50 mV of initial value,
VFM2 , IRM1.
ĆIRM1 ±100 percent or 500 µA, whichever is
greater.
12
See 4.3.1.
See 4.3.1.
13
Subgroup 2 of table I herein.
Subgroup 2 of table I herein.
Reverse energy test (see 4.5.2),
Reverse energy test (see 4.5.2),
ĆVFM2 ±50 mV,
ĆVFM2 ±50 mV,
ĆIRM1 ±100 percent or 500 µA, whichever is
ĆIRM1 ±100 percent or 500 µA, whichever
greater.
is greater.
Scope display evaluation (see 4.5.5).
Scope display evaluation (see 4.5.5).
* (1)
Shall be performed anytime after temperature cycling, screen 3a. JANTX and JANTXV levels do not need to
be repeated in screening requirements.
* 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: TA = +50°C maximum, any clips or heat
sink configuration may be utilized provided that IO and TA are adjusted to achieve TJ = +135°C minimum, VR = 45 V
(pk), IO = 0.75 A minimum, f = 60 Hz. Mounting and test conditions shall be in accordance with Method 1038 of MIL-
STD-750 , test condition B.
* 4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3101 or 4081 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, and tMD. Measurement
delay time (tMD) = 70 µs max. See table III, subgroup 4.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500. Alternate flow
is allowed for qualification inspection in accordance with figure 4 of MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I
herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in tables E-VIA (JANS) and E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and 4.4.2.1 and
4.4.2.2 herein. Electrical measurements (end-points) shall be in accordance with the applicable inspections of
table I, subgroup 2 herein. Delta measurements shall be in accordance with table II herein.
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