MIL-PRF-19500/625A
TABLE II. Group E inspection (all quality levels) for qualification only.
MIL-STD-750
Inspection
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Method
Conditions
Subgroup 1
1056
Thermal shock (glass strain)
1071
Hermetic seal
See table I, group A,
Electrical measurements
subgroup 2
Subgroup 2
Not applicable
Subgroup 3
Not applicable
Subgroup 4
Thermal resistance,
L = .953 mm (.375 inch),
3101 or
RθJL = 160°C/W maximum (see 4.5.4)
junction to lead
4081
Subgroup 5
Potted environment test
1054
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For US suffix types thermal resistance, junction to end caps.
RθJEC = 100°C/W max.
5. PACKAGING
5.1 Packaging. Packaging shall prevent mechanical damage of the devices during shipping and handling and shall not be detrimental
to the device. When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible
packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points'
packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging
data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or
by contacting the responsible packaging activity.
5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-STD-129.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification.
6.2 Acquisition requirements. See MIL- PRF-19500.
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