MIL-PRF-19500/158T
5. PACKAGING
* 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order
(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel
need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are
maintained by the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or
within the Military Service's system commands. Packaging data retrieval is available from the managing Military
Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible
packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. The
notes specified in MIL-PRF-19500 are applicable to this specification.)
6.1 Intended use. Semiconductors conforming to this specification are intended for original equipment design
applications and logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of this specification.
b. Packaging requirements (see 5.1).
c. Lead finish (see 3.4.1).
d. Product assurance level and type designator.
* 6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are,
at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML 19500) whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the
products covered by this specification. Information pertaining to qualification of products may be obtained from
Defense Supply Center, Columbus, ATTN: DSCC/VQE, P.O. Box 3990, Columbus, OH 43218-3990 or e-mail
vqe.chief@dla.mil . An online listing of products qualified to this specification may be found in the Qualified Products
Database (QPD) at https://assist.daps.dla.mil .
6.4 Substitution of radiation hardened devices. See MIL-PRF-19500.
6.5 Substitutability of dash one parts. Non-dash-one devices have been deleted from this specification. Dash-one
devices are a direct substitute for non dash-one devices and are preferred. The following table shows the direct
substitutability.
Superseded PIN
Superseding PIN
1N3154
1N3154-1
1N3155
1N3155-1
1N3156
1N3156-1
1N3157
1N3157-1
6.6 Substitution of devices. Device types within this series with higher type numbers (lower VZ voltage-
temperature stability) are a direct one-way substitution for lower type numbers (higher VZ voltage-temperature
stability).
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