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MIL-PRF-19500-158 Semiconductor Device, Diode, Silicon, Temperature Compensated, Voltage-Reference, Types 1N3154-1, Through 1N3157-1, And 1N3154Ur-1 Through 1N3157Ur-1, Jan, Jantx, Jantxv, And Jans, Radiation Hardened \(Total Dose Only\) Jantxvm, D, L, R, F, G, H, And Jansm, D, L, R, F, G, HThis specification covers the performance requirements for 8.4 volts ┬▒5 percent, silicon, temperature compensated, voltage-reference diodes. Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. Seven levels of radiation hardened \(total dose only\) product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500.

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MIL-PRF-19500/158T
3.6 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.6.1 Marking of "UR" version devices. For "UR" version devices only, all marking (except polarity) may be omitted
from the body, but shall be retained on the initial container.
3.7 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I herein.
3.8 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and
4.4.3.
3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.1.1 Sampling inspection. Sampling inspection shall be in accordance with MIL-PRF-19500 and as specified
herein, except that lot accumulation period shall be 3 months in lieu of 6 weeks.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-PRF-19500 and 4.4.5
herein.
4.2.2 Radiation hardened devices. See MIL-PRF-19500 and 4.4.4 herein.
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