MIL-PRF-19500/158T
4.4.3.1 Group C inspection, table E-VII of MIL-PRF-19500.
Method
Conditions
Subgroup
C1
2066
As specified.
C2
1056
Test condition A, 25 cycles.
C2
2036
Lead tension: Test condition A; 4 pounds weight, t = 15 ±3 seconds.
Lead fatigue: Test condition E (lead tension and fatigue tests are not
applicable to surface mount "UR" version devices).
C2
1071
Condition E.
C2
1021
Omit initial conditioning.
C3
Not applicable.
C4
1041
As specified.
C5
Not applicable.
IZ = 10.0 mA dc, TA = +100C (see 4.5.2).
C6
1026
C7
Not applicable.
4.4.4 Group D inspection. Group D inspection shall be conducted in accordance with table E-VIII of
MIL-PRF-19500 and table II herein. Submitted lots for group D sample inspection must be constructed using one
homogeneous wafer lot for the zener and one wafer lot for the compensating die (die), as also described in the
submitted DSCC Design and Construction form 36D (see table II herein).
4.4.5 Group E inspection. Group E inspection shall be conducted in accordance with table E-IX of
MIL-PRF-19500 and table III herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables as follows.
4.5.1 Voltage-temperature stability. The breakdown voltage of each diode type shall be measured and recorded at
each of the specified temperatures. The lowest measured voltage shall be subtracted from the highest measured
voltage for each diode. The difference value obtained shall not exceed the specified VZ per diode type.
4.5.2 Reference voltage time stability. The breakdown voltage shall be measured prior to life testing, at 340 hours,
and at the conclusion of the life test. The 340-hour reading shall be compared with the 0-hour reading and the 1,000-
hour reading compared with the 340-hour reading. The change in breakdown voltage shall not exceed the limits
specified (see table IV herein).
4.5.3 Reference voltage. The test current shall be applied until thermal equilibrium is attained (15 seconds
minimum) prior to reading the reference voltage. For this test, the diode shall be suspended by its leads with
mounting clips whose inside edge is located between .375 inch (9.53 mm) and .500 inch (12.70 mm) from the body
and the mounting clips shall be maintained at the specified temperature. This measurement may be performed after
a shorter time following application of the test current than that which provides thermal equilibrium if correlation to
stabilized readings can be established to the satisfaction of the Government.
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