MIL-PRF-19500-317 Semiconductor Device, Transistor, Npn, Silicon, Switching, Types 2N2369A, 2N3227, 2N4449, 2N2369Au, 2N3227U, 2N2369Aua, 2N3227Ua, 2N2369Aub, 2N2369Aubc, 2N2369Aubcn 2N3227Ub, 2N3227Ubc, 2N3227Ubcn, 2N4449U, 2N4449Ua, 2N4449Ub, 2N4449Ubc, And 2N4449Ubcn, Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhca, Janhcb, Jankca, Jankcb, Jank...This specification covers the performance requirements for NPN, silicon, high speed switching transistors \(including dual devices\). Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500, and two levels of product assurance are provided for each unencapsulated device type. Provisions for radiation hardness assurance \(RHA\) to four radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels. RHA level designators ┬ôM┬ö, ┬ôD┬ö, ┬ôP┬ô, ┬ôL┬ö, ┬ôR┬ö, ┬ôF┬Æ, ┬ôG┬ö, and ┬ôH┬ö are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/317R

3.8 Marking. Marking shall be in accordance with MIL-PRF-19500, except for the UB, UBC, and UBCN suffix

package. Marking on the UB package shall consist of an abbreviated part number, the date code, and the

manufacturers symbol or logo. The prefixes JAN, JANTX, JANTXV, and JANS can be abbreviated as J, JX, JV, and

JS respectively. The "2N" prefix and the "AUB" suffix may also be omitted. The radiation hardened designator M, D,

P, L, R, F, G, or H shall immediately precede (or replace) the device "2N" identifier (depending upon degree of

abbreviation required).

3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and

shall be free from other defects that will affect life, serviceability, or appearance.

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

a. Qualification inspection (see 4.2).

b. Screening (see 4.3).

c. Conformance inspection (see 4.4 and tables I. II, III, and IV).

4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified

herein.

4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In

case qualification was awarded to a prior revision of the specification sheet that did not request the performance of

table IV tests, the tests specified in table IV herein that were not performed in the prior revision shall be performed on

the first inspection lot of this revision to maintain qualification.

4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with table E-VI of

MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I

herein. Devices that exceed the limits of table I herein shall not be acceptable.

Screen (see table E-IV

Measurement

of MIL-PRF-19500)

JANS level

JANTX and JANTXV levels

(1) 3c

Thermal impedance (see 4.3.3)

ICES and hFE3

Not applicable

ICES; hFE3;

ICES, hFE3

ĆICES = 100 percent of initial value or

25 nA dc, whichever is greater.

ĆhFE3 = �15 percent of initial value.

See 4.3.1

Subgroups 2 and 3 of table I herein;

Subgroup 2 of table I herein;

ĆICES = 100 percent of initial value or

25 nA dc, whichever is greater;

ĆhFE3 = �15 percent of initial value.

(1) Shall be performed anytime after temperature cycling, screen 3a; JANTX and JANTXV do not need to be

repeated in screening requirements.