MIL-PRF-19500/317R
1.3 Maximum ratings. Unless otherwise specified, TA = +25°C. - Continued.
Types
RθJA
RθJC
RθJSP
°C/W
°C/W
°C/W
2N2369A
400
150
2N4449
400
150
2N3227
400
150
2N2369AUA, UB, UBC, UBCN
486
210
2N4449UA, UB, UBC, UBCN
486
210
2N3227UA, UB, UBC, UBCN
486
210
2N2369AU
350 (6)
290 (7)
2N4449U
350 (6)
290 (7)
2N3227U
350 (6)
290 (7)
(1)
Applicable for UA, UB, UBC, UBCN and U packages.
For TO-18 and TO-46 packages derate linearly 2.06 mW/°C above TA = +25°C.
(2)
*
(3)
(4)
Power dissipation limited to 360 mW per chip regardless of thermal resistance.
(5)
For UA, UB, UBC, and UBCN packages mounted on FR-4 PCB (1 Oz. Cu) with contacts 20 mils larger than
package pads. See figure 13.
(6) One side only, derate linerly 2.857 mW/°C above TSP = +25°C.
1.4 Primary electrical characteristics. Unless otherwise specified, TA = +25°C.
hFE
Type
hFE2 (2)
hFE4 (2)
VCE(sat)1
ton
toff
ts
(1)
VCE = 0.4 V dc VCE = 1.0 V dc
IC = 10 mA dc
IC = 10 mA dc
IC = 10 mA dc IC = 10 mA dc
VCE = 10 V dc
IC = 30 mA dc IC = 100 mA dc
IB = 1 mA dc
IB1 = 3 mA dc
IB1 = 3 mA dc
IB1 = IB2 =
IC = 10 mA dc
IB2 = -1.5 mA dc IB2 = -1.5 mA dc
10 mA dc
f = 100 MHz
Min Max
Min Max
Min
Max
V dc Max
ns
ns
ns
2N2369A
30 120
20
120
5.0
10
0.20
12
18
13
2N3227
40 250
30
150
5.0
10
0.20
12
25
18
2N4449
30 120
20
120
5.0
10
0.20
12
18
13
(1) Electrical characteristics for the A, AU, AUBC, U, UA, UB, and UBC suffix devices are identical to the
corresponding non-suffix device.
(2) Pulsed (see 4.5.1).
2
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