MIL-PRF-19500/354L
TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Limit
Unit
Symbol
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
n = 45 devices, c = 0
examination 3/
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Hermetic seal 4/ 6/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Electrical measurements 4/
Table I, subgroup 2
Bond strength 3/ 4/
2037
Precondition
TA = +250°C at t = 24 hours or
TA = +300°C at t = 2 hours,
n = 11 wires, c = 0
Decap internal visual (design
2075
n = 4 devices, c = 0
verification) 4/
Subgroup 2
ĆVBE
Thermal response
3131
See 4.3.3
mV
Collector to base cutoff current
3036
Condition D.
ICBO1
µA dc
2N2604, UB
10
VCB = 80 V dc
µA dc
2N2605, UB
10
VCB = 70 V dc
Bias condition D; IC = 10 mA dc;
60
V dc
Collector - emitter
3011
V(BR)CEO
breakdown voltage
pulsed (see 4.5.1)
µA dc
10
Emitter - base
3061
Bias condition D;
IEBO1
cutoff current
VEB = 6 V dc
10
nA dc
Collector - base
3036
Bias condition D;
ICBO2
cutoff current
VCB = 50 V dc
2
nA dc
Emitter - base
3061
Bias condition D;
IEBO2
cutoff current
VEB = 5 V dc
10
nA dc
Collector - emitter
3041
Bias condition C;
ICES
cutoff current
VCE = 50 V dc
See footnotes at end of table.
12
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