MIL-PRF-19500/359K
4.5.3 Burn-in and life tests. These tests shall be conducted with a half-sine waveform of the specified peak voltage
impressed across the diode in the reverse direction followed by a half-sine waveform of the specified average
rectified current. The forward conduction angle of the rectified current shall be neither greater than 180 degrees nor
less than 150 degrees.
4.5.3.1 Burn-in and life tests The use of a current limiting or ballast resistor is permitted provided that each DUT
still sees the required TJ and full rated Io and that the minimum required voltage VRWM is maintained throughout the
burn-in period. Use method 3100 of MIL-STD-750 to measure TJ.
4.5.3.2 Mounting conditions. At the option of the manufacturer, any clips or heat sink mounting configurations may
be utilized provided that IO is increased such that the junction temperature of each diode is maintained at +135°C
minimum for screening and +150°C minimum for life test and that the minimum required voltage VRWM is maintained
throughout the burn-in period. Use test method 3100 of MIL-STD-750 to measure TJ.
4.5.4 Scope display evaluation. Scope display evaluation shall be sharp and stable in accordance with method
4023 of MIL-STD-750. Scope display may be performed on ATE (automatic test equipment) for screening only with
the approval of the qualifying activity. Scope display in group A shall be performed on a curve tracer. The reverse
current (IBR) over the knee shall be 500 µA peak.
4.5.5 Peak reverse power test. Peak reverse power, PRM > 318 W for square wave in accordance with method
4065 of MIL-STD-750 (PRM > 500 W for half sine-wave). Test shall be performed on each sublot; sampling plan n =
10, c = 0. Electrical end-points shall be in accordance with table I, subgroup 2 herein.
4.5.6 Thermal resistance. Thermal resistance measurement shall be performed in accordance with method 4081
of MIL-STD-750 using the guidelines in that method for determining IM, IH, and tH. Measurement delay time tMD = 70
µs max. See table E-IX of MIL-PRF-19500, subgroup 4, and the thermal resistance versus pad area (for each pad)
with 1, 2, and 3 oz copper for 1N4942 through 1N4948 figure herein. Forced moving air or draft shall not be
permitted across the devices during test.
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