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MIL-PRF-19500-374 Semiconductor Device, Transistor, Npn, Silicon, Power, Types 2N3996 Through 2N3999, Jan, Jantx, Jantxv, Jans, Janhc And JankcThis specification covers the performance requirements for NPN silicon, power transistors for use in high-speed power switching applications. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for the unencapsulated die.

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MIL-PRF-19500/374E
NOTES:
1.  Chip size......................
82 X 82 mils
2.  Chip thickness .............
6 to 12 mils
3.  Top metal ....................
Aluminum 25,000 Å minimum, 30,000 Å nominal
4.  Back metal...................
Gold 2,500 Å minimum, 3,000 Å nominal
5.  Backside......................
Collector
6.  Bonding pad ................
B = 8 x 60 mils, E = 8 x 50 mils
FIGURE 3. JANHC and JANKC (A-versions) die dimensions.
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