MIL-PRF-19500/376K
4.2.2 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table III tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
4.2.2.1 Group E thermal response. With extremely small junction devices such as this one, a true thermal
impedance cannot be measure, only calculated. While "thermal response" has been substituted for "thermal
impedance" herein, the terms, units and procedure as essentially unchanged. Each supplier shall submit a thermal
response (ZθJX) histogram of the entire qualification lot. The histogram data shall be taken prior to the removal of
devices that are atypical for thermal response. Thermal response curves (from ZθJX test pulse time to RθJX minimum
steady-state time) of the best device in the qual lot and the worst device in the qual lot (that meets the supplier
proposed screening limit), or from the thermal grouping, shall be submitted. The optimal test conditions and
proposed initial thermal response screening limit shall be provided in the qualification report. Data indicating how the
optimal test conditions were derived for ZθJX shall also be submitted. The proposed maximum thermal response ZθJX
screening limit shall be submitted. The qualifying activity may approve a different ZθJX limit for conformance
inspection end-point measurements as applicable. Equivalent data, procedures, or statistical process control plans
may be used for part, or all, of the above requirements. The approved thermal response conditions and limit for ZθJX
shall be used by the supplier in screening and table I, subgroup 2. The approved thermal resistance conditions for
RθJX shall be used by the supplier for conformance inspection. For product families with similar thermal
characteristics based on the same physical and thermal die, package, and construction combination (thermal
grouping), the supplier may use the same thermal response curves.
* 4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table
Measurement
E-IV of
JANS level
JANTX and JANTXV levels
MIL-PRF-19500)
(1) 3c
Thermal response, method 3131 of
Thermal response, method 3131 of
MIL-STD-750. (see 4.3.3)
MIL-STD-750. (see 4.3.3)
9
ICBO2, hFE4
Not applicable
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48 hours minimum
48 hours minimum
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ICBO2; hFE4;
ICBO2 ,hFE4
ICBO2 = 100 percent of initial value or
2 nA dc, whichever is greater.
hFE4 = 15 percent
12
See 4.3.2
See 4.3.2
13
Subgroups 2 and 3 of table I herein;
Subgroup 2 of table I herein;
ICBO2 = 100 percent of initial value or
ICBO2 = 100 percent of initial value or
2 nA dc, whichever is greater;
2 nA dc, whichever is greater;
hFE4 = 15 percent
hFE4 = 25 percent
*
(1) Shall be performed anytime after temperature cycling, screen 3a; JANTX and JANTXV levels do not need to
be repeated in screening requirements.
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