MIL-PRF-19500-376 Semiconductor Device, Transistor, Npn, Silicon, Low-Power, Types 2N2484, 2N2484Ua, 2N2484Ub, 2N2484Ubc, 2N2484Ubn, 2N2484Ubcn Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh Janhca, Janhcb, Jankca, Jankcb, Jankcm, Jankcd, Jankcp, Jankcl, Jankcr, Jankcf, Jankcg, And JankchThis specification covers the performance requirements for NPN, silicon, low-power transistors. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for die. RHA level designators "M", "D", "P", "L", "R", "F", "G" and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/376K

A- version

NOTES:

.015 inch (0.381 mm) x .019 inch (0.483 mm) .001 inch (0.025 mm).

1. Die size:

.010 inch (0.254 mm) .0015 inch (0.038 mm).

2. Die thickness:

3. Top metal:

Aluminum 15,000 � minimum, 18,000 � nominal.

4. Back metal:

Gold 3,500 � minimum, 5,000 � nominal.

5. Backside:

Collector.

6. Bonding pad:

B = .003 inch (0.076 mm), E = .004 inch (0.102 mm) diameter.

7. Millimeter equivalents are given for general information only.

FIGURE 4. Physical dimensions, JANHC and JANKC die, A - version.