MIL-PRF-19500-376 Semiconductor Device, Transistor, Npn, Silicon, Low-Power, Types 2N2484, 2N2484Ua, 2N2484Ub, 2N2484Ubc, 2N2484Ubn, 2N2484Ubcn Jan, Jantx, Jantxv, Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh Janhca, Janhcb, Jankca, Jankcb, Jankcm, Jankcd, Jankcp, Jankcl, Jankcr, Jankcf, Jankcg, And JankchThis specification covers the performance requirements for NPN, silicon, low-power transistors. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for die. RHA level designators "M", "D", "P", "L", "R", "F", "G" and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/376K

B - version

NOTES:

1. Die size:

.018 inch (0.457 mm) x .018 inch (0.457 mm).

.008 inch (0.203 mm) .0016 inch (0.041 mm).

2. Die thickness:

3. Base pad:

.0025 inch (0.064 mm) diameter.

4. Emitter pad:

.003 inch (0.076 mm) diameter.

Gold, 6,500 1,950 �.

5. Back metal:

Aluminum, 19,500 2,500 �.

6. Top metal:

7. Back side:

Collector.

SiO2, 7,500 1,500 �.

8. Glassivation:

9. Millimeter equivalents are given for general information only.

FIGURE 5. Physical dimensions, JANHC and JANKC die, B - version.