MIL-PRF-19500-391 Semiconductor Device, Transistor, Npn, Silicon, Low-Power Types 2N3019, 2N3019S, 2N3057A, 2N3700, And 2N3700Ub, Jan, Jantx, Jantxv, Jantxvm, Jantxvd, Jantxvp, Jantxvl, Jantxvr, Jantxvf, Jantxvg, Jantxvh Jans, Jansm, Jansd, Jansp, Jansl, Jansr, Jansf, Jansg, Jansh, Janhca, Janhcb, Jankca, Jankcb Jankcbm, Jankcd, Jankcp, Jankcl, Jankcr, Jankcf, Jankcg, And JankchThis specification covers the performance requirements for NPN, silicon, low-power transistors. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for the unencapsulated device type 2N3700. Provisions for radiation hardness assurance \(RHA\) to three radiation levels is provided for JANTXV JANS, JANHC, and JANKC product assurance levels. Radiation hardness assurance \(RHA\) level designators "M", "D", "P", "L", "R", "F", "G" and "H" are appended to the device prefix to identify devices, which have passed RHA requirements.

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MIL-PRF-19500/391N

2. APPLICABLE DOCUMENTS

* 2.1 General. The documents listed in this section are specified in sections 3 or 4 of this specification. This section

does not include documents cited in other sections of this specification or recommended for additional information or

as examples. While every effort has been made to ensure the completeness of this list, document users are

cautioned that they must meet all specified requirements documents cited in sections 3 or 4 of this specification,

whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a

part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are

those cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

Semiconductor Devices, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL�STD�750

Test Methods for Semiconductor Devices.

* (Copies of these documents are available online at https://quicksearch.dla.mil)

2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the

text of this document and the references cited herein, the text of this document takes precedence. Nothing in this

document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 General. The individual item requirements shall be as specified in MIL�PRF�19500 and as modified herein.

3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)

before contract award (see 4.2 and 6.3).

3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as

specified in MIL�PRF�19500 and as follows.

PCB ....................... Printed circuit board.

RθJA ........................ Thermal resistance junction to ambient.

RθJC ........................ Thermal resistance junction to case.

RθJSP(IS) ................... Thermal resistance junction to solder pads (infinite sink mount to PCB).

TSP(IS)...................... Temperature of solder pads (infinite sink mount to PCB).

UB .......................... Surface mount case outlines (see figure 4).

3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in

MIL�PRF�19500, and on figure 1 (2N3019, TO-5, 2N3019S, TO-39), figure 2 (2N3057A, TO-46), figure 3 (2N3700,

TO-18), figure 4 (2N3700UB, surface mount) figure 5 (JANHCA, JANKCA), and figure 6 (JANHCB, JANKCB) herein.

3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL�PRF�19500, MIL�STD�750, and herein.

Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).