MIL-PRF-19500/391N
TABLE I. Group A inspection.
Inspection 1/
Symbol
Limit
Unit
Method
Conditions
Min
Max
Subgroup 1 2/
Visual and mechanical
2071
examination
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles
n = 22 devices, c = 0
Hermetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Group A, subgroup 2
Electrical measurements 4/
Bond strength 3/ 4/
2037
Precondition
TA = +250°C at t = 24 hrs or TA =
+300°C at t = 2 hrs, n = 11 wires, c = 0
Decap internal visual
2075
n = 4 devices, c = 0
(design verification) 4/
Subgroup 2
°C/W
Thermal impedance
3131
See 4.3.2
ZθJX
µA dc
Collector to base cutoff
3036
10
Bias condition D; VCB = 140 V dc
ICBO1
current
µA dc
Emitter to base cutoff
3061
10
Bias condition D; VEB = 7 V dc
IEBO1
current
Collector to emitter
3011
80
V dc
Bias condition D; IC = 30 mA dc pulsed
V(BR)CEO
breakdown voltage
(see 4.5.1)
Collector to emitter cutoff
3041
10
nA dc
Bias condition C; VCE = 90 V dc
ICES1
current
Emitter to base cutoff
3061
10
nA dc
Bias condition D; VEB = 5 V dc
IEBO2
current
Forward current transfer
3076
100
300
VCE = 10 V dc; IC = 150 mA dc; pulsed
hFE1
ratio
(see 4.5.1)
Forward current transfer
3076
50
300
VCE = 10 V dc; IC = 0.1 mA dc; pulsed
hFE2
ratio
(see 4.5.1)
See footnotes at end of table.
16
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