MIL-PRF-19500/485N
TABLE I. Group A inspection.
Inspection 1/
MIL-STD-750
Symbol
Limits
Unit
Min
Max
Method
Conditions
Subgroup 1 2/
Visual and mechanical 3/
2071
examination
Solderability 3/ 4/
2026
n = 15 leads, c = 0
Resistance to solvents
1022
n = 15 devices, c = 0
3/ 4/ 5/
Temp cycling 3/ 4/
1051
Test condition C, 25 cycles.
n = 22 devices, c = 0
Hermetic seal 4/
1071
n = 22 devices, c = 0
Fine leak
Gross leak
Table I, subgroup 2
Electrical measurements 4/
Precondition TA = +250°C at
Bond strength 3/ 4/
2037
t = 24 hrs or TA = +300°C at
t = 2 hrs
n = 11 wires, c = 0
2075
n = 4, c = 0.
Decap internal visual design
verification
Subgroup 2
°C/W
Thermal impedance 6/
3131
See 4.3.2
ZθJX
µA dc
Collector to emitter cutoff current
3041
Bias condition D
50
ICE01
2N5415, S, UA, U4
VCE = 150 V dc
2N5416, S, UA, U4
VCE = 250 V dc
Collector to emitter cutoff current
3041
Bias condition D
1
mA dc
ICE02
2N5415, S, UA, U4
VCE = 200 V dc
2N5416, S, UA, U4
VCE = 300 V dc
µA dc
Collector to emitter cutoff current
3041
50
ICEX
Bias condition A, VBE = 1.5 V dc
VCE = 200 V dc
2N5415, S, UA, U4
2N5416, S, UA, U4
VCE = 300 V dc
µA dc
Emitter to base cutoff current
3061
Bias condition D,
IEBO
20
VEB = 6 V dc
See footnotes at end of table.
13
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