MIL-PRF-19500/505E
* 4.3 Screening. Screening shall be in accordance with table E-IV of MIL-PRF-19500, and as specified herein.
The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table
I herein shall not be acceptable.
Screen (see table E-IV
Measurements
of MIL-PRF-19500)
JANTX and JANTXV levels
(1) 3c
Thermal impedance method 3131 of MIL-STD-750 (see 4.3.2)
7
Optional
ICEX1 and hFE1
11
12
See 4.3.1
Subgroup 2 of table I herein; ICEX1 = 100 percent of initial value
13
or 2 A dc, whichever is greater;
hFE1 = ±40 percent of initial value
14
Required
(1) Shall be performed anytime after temperature cycling, screen 3a of 4.3 herein; and does not need to be
repeated in screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: TJ = +162.5C ±12.5C,
VCE -10 V dc. NOTE: No heat sink or forced air cooling on the devices shall be permitted.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with
method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW (VC and VH where
appropriate). Measurement delay time (tMD) = 70 s max.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein. Electrical measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
* 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein.
Method
Condition
Subgroup
For solder die attach: VCB -10 V dc; TA +35C, 2,000 cycles.
B3
1037
For eutectic die attach: TA +35C adjust PT to achieve TJ = +150C
B3
1027
minimum, VCB -10 V dc.
RJC = 0.855C/W (maximum).
B5
3131
6
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